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общая лексика
глухое переходное отверстие
в САПР электроники - несквозное переходное отверстие, которое достигает только одного внешнего слоя печатной платы
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['vaiə]
общая лексика
переходное отверстие, ПО
в САПР печатных плат различают переходные отверстия межслойные и сквозные (through via)
посредством
путь
транзитный
через
существительное
['vaiə]
Латинский язык
путь
предлог
общая лексика
через
по маршруту через
с заходом
путём
через посредство
с помощью
A via (Latin for path or way) is an electrical connection between copper layers in a printed circuit board. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with copper that forms electrical connection through the insulation that separates the copper layers.
Vias are important for PCB manufacturing. This is because the vias are drilled with certain tolerances and may be fabricated off their designated locations, so some allowance for errors in drill position must be made prior to manufacturing or else the manufacturing yield can decrease due to non-conforming boards (according to some reference standard) or even due to failing boards. In addition, regular through hole vias are considered fragile structures as they are long and narrow; the manufacturer must ensure that the vias are plated properly throughout the barrel and this in turn causes several processing steps.